The 2nd International Symposium on Electronic Information Engineering and Intelligent Communication
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About EIC 2025

The 2nd International Symposium on Electronic Information Engineering and Intelligent Communication


The 2nd International Conference on Electronic Information Engineering and Intelligent Communication (EIC 2025) will be held from November 14-16, 2025 in Xiamen, China. EIC 2025 will focus on the latest research areas in electronic information engineering and intelligent communication, providing an international platform for experts, professors, scholars, and engineers from universities, research institutes, and enterprises both domestically and internationally to share professional experiences, expand their professional networks, and showcase research achievements. The conference aims to promote the development and application of theories and technologies in this field within universities and enterprises, as well as to facilitate connections and collaborations among attendees for future global partnerships. We invite experts, scholars, practitioners from universities, research institutions, industry professionals, and other related individuals to participate and exchange ideas at this conference.

Important Dates

Full Paper Submission Date

Registration Deadline

Final Paper Submission Date

Conference Dates

September 10, 2025

October 5, 2025

October 20, 2025

November 14-16, 2025

▶ Submission

news.gif Please send the full paper(word+pdf) to Submission System : 

Submission (Chinese)

Submission  (English)

For more information, please click: Submission

▶ Registration

Access the registration system, Fill information and pay online. : 

Registration (Chinese)

Registration  (English)

For more information, please click: Registration

▶ Call For Papers

The topics of interest for submission include, but are not limited to:

Call for Papers

Templates: Downloads

▶ Publication

hot.gif Submitted paper will be peer reviewed by conference committees, and accepted papers after registration and presentation will be published in the Conference Proceedings, which will be submitted for indexing by Ei Compendex, Scopus.

▶ Sponsored By

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